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InGaAs-optimized linear readout integrated circuit for photodiode arrays


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Linear array, 512 × 1 format, 25-micron channel pitch that supports both wire and bump bonding detector interfaces. It’s user configurable as a 512 × 1, 256 × 1 or 128 × 1 array. The ISC9802 is low noise, has a low input impedance front end, a correlated double sampling stage and wide range of selectable integration capacitors.


The end-of-sale date to order the affected product is March 18, 2024. Customers will continue to receive support from Teledyne FLIR until June 30, 2025. See the notice below for additional details.

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Export Restrictions

Export Restrictions

The information contained in this page pertains to products that may be subject to the International Traffic in Arms Regulations (ITAR) (22 C.F.R. Sections 120-130) or the Export Administration Regulations (EAR) (15 C.F.R. Sections 730-774) depending upon specifications for the final product; jurisdiction and classification will be provided upon request.