See the Heat – Troubleshooting PCB & Electronic Product Design with Thermal Imaging
See the Heat – Troubleshooting PCB & Electronic Product Design with Thermal Imaging
As electronic circuit boards and components get smaller and more powerful, inherent heat can cause failures and significant damage. In this brief recorded webinar, FLIR Business Development Manager for Science, Jerry Beeney, compares traditional temperature measurement devices with infrared imaging. He uses real-world infrared images and examples to detail how infrared thermography can more easily identify hot spots, allowing for improved thermal management and greater advances in circuit board design.
